200 mm
200 mm (8") wafers were introduced in 1985 and are still considered the industry standard today.There are more 200 mm wafers produced world wide than any other diameter. These wafers are used for a variety of applications that include testing and calibrating equipment to devices that might be used in your cellular phone or flat screen television. SVM carries a large variety of 200 mm wafers in our multi-million dollar inventory. Here are examples of some of the specifications available.
If you do not see the specification you are looking for, please contact SVM to speak with a member of our experienced and knowledgeable sales staff.
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200 +/- 0.2 mm
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Diameter
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200 +/- 0.2 mm
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200 +/- 0.2 mm
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200 +/- 0.2 mm
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200 +/- 0.2 mm
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200 +/- 0.2 mm
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200 +/- 0.2 mm
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Type / Dopant
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P/Boron
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P/Boron
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P/Boron
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P/Boron
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P/Boron
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P/Boron
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Orientation
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{100} +/- 1º
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{100} +/- 1º
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{100} +/- 1º
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{100} +/- 1º
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{100} +/- 1º
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{100} +/- 1º
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Growth Method
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Cz
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Cz
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Cz
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Cz
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Cz
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Cz
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Grade
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Epi
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Resistivity
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10 - 30 Ω-cm
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10 - 20 Ω-cm
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1 - 100 Ω-cm
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1 - 50 Ω-cm
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0.005 – 0.02 Ω-cm
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Customer Specified
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Metals
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< 5 x E9
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< 5 x E10
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< 5 x E10
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< 5 x E9
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Thickness
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700 - 750 μm
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710 - 740 μm
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700 - 750 μm
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700 - 750 μm
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700 - 750 μm
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700 - 750 μm
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Epi Layer Thickness
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Customer Specified
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TTV
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<= 3 μm
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<= 6 μm
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<= 4 μm
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<= 10 μm
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<= 5 μm
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<= 10 μm
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GTIR
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<= 5 μm
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<= 5 μm
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Bow / Warp
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<= 40 μm
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<= 40 μm
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<= 40 μm
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<= 50 μm
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<= 40 μm
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<=40 μm
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Site Flatness (STIR)
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<= 1 μm
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<= 2 μm
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<= 0.2 μm
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<= 1 μm
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Front Surface
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Polished
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Polished
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Polished
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Polished
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Polished
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Polished
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Back Surface
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Etched
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Etched
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Etched
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Etched
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Etched
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Etched or Oxide Back Seal
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Particle Count
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<= 50 @ >= 0.12 μm
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<= 50 @ >= 0.16 μm
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<= 50 @ >= 0.16 μm
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<= 30 @ >= 0.2 μm
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<= 50 @ >= 0.16 μm
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Notch
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SEMI Standard
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SEMI Standard
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SEMI Standard
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SEMI Standard
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SEMI Standard
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SEMI Standard
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Edges
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Rounded and polished per SEMI Standard
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Rounded and polished per SEMI Standard
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Rounded and polished per SEMI Standard
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Rounded and polished per SEMI Standard
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Rounded and polished per SEMI Standard
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Rounded and polished per SEMI Standard
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