Lithography
SVM provides a wide variety of wafer patterning solutions catered to the semiconductor and MEMS industries. Standard test patterns are available for CMP, Etch, Clean, and Medical Device manufacturing markets on glass and silicon substrates. In addition to our standard test pattern offerings, SVM accepts custom wafer patterning projects based upon end-user design with an option to provide engineering CAD and mask manufacture.
Materials: Silicon, Glass
Wafer Diameters: 50mm to 300mm
Lithography Tools: Scanner, Stepper, Proximity/contact aligner, E-Beam
Technology Nodes: 65nm, 90nm, 130nm, 180nm, 250nm and larger
Photoresist: 193nm, 248nm(DUV), I-Line
Etch: Wet, RIE, DRIE
CMP: W, Cu, Al, Oxide, TEOS
Metrology: SEM, Cross Section, E- Test etc.
Test Reticles:
Surface Trench Isolation (STI)
Damascene and Dual Damascene
Line /Space Arrays
Via Arrays
Daisy Chain
Memory Patterns
Specialty Products:
Precious Metals: Au, Pd, Ag, Pt
Thick Photoresist
SVM offers Through-Silicon Via (TSV) wafers with a via depth of 100um and a diameter of 50um.
The Through-Silicon Via (TSV) is etched with excellent sidewall surface roughness from the center of the wafer to the edge of the wafer aligned to the notch.
All Through Silicon Vias are etched on a 10 to 100um Via Etch Pattern Layout for a 200mm wafer.
The electroplated copper layer is 10,000 angstroms followed by 2um Cu seed layer and 1000 angstroms Titanium Liner on TEOS.
Cross Section
Si vias, before Cu seed aft. Cu seed
SVM offers Through-Silicon Via (TSV) wafers with the ability to electrical test vias with diameters of 10um, 20um, 30um, 40um, 45um, 50um, 55um, and 60um.
The Through-Silicon Via (TSV) is etched with excellent sidewall surface roughness from the center of the wafer to the edge of the wafer aligned to the notch.
All Through-Silicon Vias are etched on a 200mm wafer.
The electroplated copper layer is 10,000 angstroms followed by 2um Cu seed layer and 1000 angstroms Titanium Liner on TEOS.
Please CONTACT SVM for further information on Lithography services or to discuss your current requirements.