50 mm (2”) wafers were first introduced in 1970. They are no longer in mass production, but are still used for a wide variety of projects. SVM has a number of different 50 mm wafer specifications in stock. These wafers are widely used by colleges and universities and for many research and development projects. Listed below are some of the more common specifications. If you do not see the specification you are looking for, please contact SVM to speak with a member of our experienced and knowledgeable sales staff.

Diameter: 50 +/- 0.2 mm
Type/Dopant: P/Boron
Orientation: <100> +/- 1°
Growth Method: Cz
Resistivity: 1-100 Ω-cm
Thickness: 250-300 μm
Frontside: Polished
Backside: Etched
Flats: 2 SEMI Standard
Edges: Rounded and polished per SEMI Standard

Diameter: 50 +/- 0.2 mm
Type/Dopant: P/Boron
Orientation: <100> +/- 1°
Growth Method: Cz
Resistivity: 1-20 Ω-cm
Thickness: 200-250 μm
Frontside: Polished
Backside: Polished
Flats: 2 SEMI Standard
Edges: Rounded and polished per SEMI Standard

Diameter: 50 +/- 0.2 mm
Type/Dopant: Customer Specified
Orientation: Customer Specified
Growth Method: Cz
Resistivity: Customer Specified
Thickness: Customer Specified
Frontside: Polished
Backside: Customer Specified
Flats: 2 SEMI Standard
Edges: Rounded and polished per SEMI Standard