76.2 mm (3”) wafers were first introduced in 1973 shortly after 50 mm wafers went into production. 3” wafers are still widely used by many colleges, universities and research and development facilities. Listed below are some common specifications. If you do not see the specification you are looking for, please contact SVM to speak with a member of our experienced and knowledgeable sales staff.

Diameter: 76.2 +/- 0.2 mm
Type/Dopant: N/Phosphorus
Orientation: <100> +/- 1°
Growth Method: Cz
Resistivity: 10-20 Ω-cm
Thickness: 350-400 μm
Front Surface: Polished
Back Surface: Etched
Flats: 2 SEMI Standard
Edges: Rounded and polished per SEMI Standard

Diameter: 76.2 +/- 0.2 mm
Type/Dopant: P/Boron
Orientation: <100> +/- 1°
Growth Method: Cz
Resistivity: 1-100 Ω-cm
Thickness: 350-400 μm
Front Surface: Polished
Back Surface: Etched
Flats: 2 SEMI Standard
Edges: Rounded and polished per SEMI Standard

Diameter: 76.2 +/- 0.2 mm
Type/Dopant: Customer Specified
Orientation: Customer Specified
Growth Method: Cz
Resistivity: Customer Specified
Thickness: Customer Specified
Front Surface: Polished
Back Surface: Customer Specified
Flats: 2 SEMI Standard
Edges: Rounded and polished per SEMI Standard