Thin Wafers
SVM supplies wafers with a final of thickness of 50 μm and less. Depending on your specifications, SVM can have wafers custom processed
for you to meet your exact thickness requirements. Depending on the wafer diameter, final thickness can be as thin as 30 μm. This
cutting edge technology can be used for a number applications, including Smart Card devices, electronics stickers and labels and
chips on paper.
Wafers can be supplied as double-side polished, as ground or as lapped. Wafers can also go through a "de-stressing" process to make them more flexible and limit the possibility of breakage.
Please contact a member of our knowledgeable sales staff to learn more or request a quotation.
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Silicon Wafer Services : Silicon Wafer Films > Silicon Wafer Processing > Silicon Wafer Reclaim > Silicon Wafer Recycle > Silicon Wafers Information
Silicon Wafer Products : Test Grade Silicon Wafers > Thick Silicon Wafers > Thin Silicon Wafers > Prime Grade Silicon Wafers
Reclaimed Silicon Wafers