Silicon Wafers

50mm-300mm Silicon Wafers

Silicon Valley Microelectronics provides different diameter silicon wafers (300mm, 200mm, 150mm, 125mm, 100mm, 76mm, and 50mm) in a variety of specifications, suitable for a wide range of applications.

The diameter of a silicon wafer significantly impacts its application and efficiency.

• 50mm Silicon Wafers: Smaller silicon wafers like the 50mm variants are typically used for specialized applications, research, and development projects. They are ideal for prototyping and small-scale production, allowing engineers to test designs before scaling up.
• 200mm Silicon Wafers: The 200mm size represents a popular choice for medium-scale production. These silicon wafers provide a balance between manufacturing efficiency and cost-effectiveness. They are widely used in the production of analog and digital ICs, catering to various consumer electronics.
• 300mm Silicon Wafers: The larger 300mm silicon wafers are at the forefront of semiconductor manufacturing. They offer higher throughput and reduced production costs per chip, making them ideal for high-volume applications. The transition to 300mm silicon wafers has allowed manufacturers to keep pace with the increasing demand for advanced microprocessors and memory chips.

You can find our inventory of the different diameters we offer through the links here: 300mm, 200mm, 150mm, 125mm, 100mm, 76mm, 50mm 

Double Side Polished Wafers (DSP)

Silicon Valley Microelectronics uses simultaneous double-side polishing technology, and therefore can supply a wide variety of high-quality ultra-flat wafers to meet the exact controlled flatness requirements of each customer.

The dual polishing process enhances the silicon wafer‘s characteristics in several ways:

• Superior Surface Quality: The smooth surfaces reduce roughness, crucial for applications requiring precise optical and electrical performance.
• Uniform Thickness: Consistent thickness across the silicon wafer ensures reliable performance in semiconductor devices and other applications.
• Enhanced Performance: Improved surface characteristics promote better adhesion for coatings and thin films, which is vital in high-tech applications.

Ultra Flat Wafers

Silicon Valley Microelectronics can supply a wide variety of high-quality ultra-flat wafers to meet the exact controlled flatness requirements of each customer.

The defining characteristic of ultra flat silicon wafers is their extreme flatness, which significantly reduces surface defects and variations. This precision is achieved through advanced manufacturing techniques, including:

• High-Precision Polishing: This process ensures that both surfaces of the silicon wafer are polished to achieve a flatness that minimizes warpage and distortion.
• Rigorous Inspection: Ultra flat silicon wafers undergo extensive testing to verify their flatness and surface quality, making them suitable for the most demanding applications.

Float Zone Wafers (FZ)

Silicon Valley Microelectronics offers float zone (FZ) wafers ranging in diameter from 50mm to 200mm. These wafers have a low concentration of impurities and high-temperature capabilities. The properties of FZ wafers give them advantages over CZ wafers in a variety of applications.

Float zone silicon wafers are a premium type of silicon wafer known for their exceptional purity and superior electrical properties. Produced through a unique float zone process, these wafers are essential for high-performance applications in the semiconductor industry.

Manufacturing Process

The float zone process involves melting a rod of high-purity silicon while it is passed through a heated zone. This method allows for the segregation of impurities, resulting in a silicon wafer that has fewer defects and a uniform crystalline structure. The key steps include:

1. Heating: A localized heating zone melts the silicon as it is pulled upward.
2. Solidification: As the molten silicon cools, it crystallizes into a highly pure form.

Low Resistivity Wafers

Silicon Valley Microelectronics supplies both N-type and P-type low resistivity wafers in all diameters, 50mm to 300mm, with or without backseal. We can achieve resistivity <0.01 ohm-cm.

The resistivity of a silicon wafer is influenced by its doping concentration. Low resistivity wafers typically have higher levels of dopants, such as phosphorus or boron, which enhance their conductivity. This results in:

• Improved Electrical Conductivity: Lower resistivity allows for better current flow, making these wafers ideal for power devices and high-frequency applications.
• Uniform Doping Profiles: Consistent doping throughout the silicon wafer ensures reliable performance across different regions of the wafer.

N-Type Wafers

Silicon Valley Microelectronics supplies a variety of N-type wafers with phosphorus/antimony/arsenic dopant, in diameters ranging from 50mm to 300mm.

N-type silicon wafers are created by doping pure silicon with elements such as phosphorus or arsenic. This process introduces extra electrons into the silicon lattice, resulting in:

• Increased Electron Concentration: The added dopants increase the number of free electrons, enhancing the electrical conductivity of the silicon wafer.
• Negative Charge Carriers: As the name suggests, n-type wafers have an abundance of negatively charged carriers (electrons), which are responsible for electrical conduction.

Coinroll Wafers

Silicon Valley Microelectronics offers a variety of 200mm and 300mm coinroll wafers.

Coinroll silicon wafers are characterized by their specific geometry, resembling a rolled coin. This design provides several benefits:

• Enhanced Surface Area: The coinroll shape increases the effective surface area of the silicon wafer, which can improve the efficiency of processes such as chemical vapor deposition (CVD) and etching.
• Improved Handling: The shape allows for easier handling and processing in automated manufacturing environments.