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SILICON WAFERS

300mm (12")
Silicon Wafers
200mm (8")
Silicon Wafers
Small Diameter
Silicon Wafers
Double Side Polished Wafers
Ultra Flat Wafers
Float Zone
Wafers
Low Resistivity
Wafers
N-Type
Wafers
Coinroll
Wafers

Silicon on Insulator

Thick Film SOI

  • SOI with a device layer >=2µm
  • Fabricated with a Bond and Grind method
  • 50mm – 200mm diameter offerings
  • Excess inventory options and custom manufacturing capability

Thin Film SOI

  • SOI with a device layer <2µm
  • Fabricated with Hydrogen implantation
  • Specialize in device thicknesses of 70nm-500nm
  • Excess inventory options and custom manufacturing capability

Cavity SOI

  • C-SOI fabrication for parameters within our cavity design rules

Materials

Glass Wafers

Borosilicate, Fused Silica, Fused Quartz & Soda Lime. Schott®, Corning® and more.

Sapphire

A-Plane, C-Plane, R-Plane. Specializing in 50mm-150mm diameters.

Compound Semiconductors

Germanium, GaP, GaAs, GaN, InP and LinbO3.

NON-SILICON WAFERS

SILICON CARBIDE

4H SiC

  • 50mm (2″) – 150mm (6″) 4H SiC
  • Nitrogen doped, Vanadium doped, Undoped, and HPSI
  • On and Off Axis options
  • Single Side or Double Side Polished

6H SiC

  • 50mm (2”) and 100mm (4”) 6H SiC
  • Type/Dopant options may vary with availability
  • Single Side or Double Side Polished

Anywhere in the Bay Area within 4 hours.

In the United States within 1 day.

Internationally within 3 days.