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SILICON WAFERS

300mm (12")
Silicon Wafers

200mm (8")
Silicon Wafers

Small Diameter
Silicon Wafers

Double Side Polished Wafers

Ultra Flat Wafers

Float Zone
Wafers

Low Resistivity
Wafers

Coinroll
Wafers

Silicon on Insulator

Thick Film SOI

SOI with a device layer >=2µm
Fabricated with a Bond and Grind method
50mm – 200mm diameter offerings
Excess inventory options and custom manufacturing capability

Thin Film SOI

SOI with a device layer <2µm
Fabricated with Hydrogen implantation
Specialize in device thicknesses of 70nm-500nm
Excess inventory options and custom manufacturing capability

Cavity SOI

C-SOI fabrication for parameters within our cavity design rules

Materials

Glass Wafers

Borosilicate, Fused Silica, Fused Quartz & Soda Lime. Schott®, Corning® and more.

Sapphire

A-Plane, C-Plane, R-Plane. Specializing in 50mm-150mm diameters.

Compound Semiconductors

Germanium, GaP, GaAs, GaN, InP and LinbO3.

NON-SILICON WAFERS

SILICON CARBIDE

4H SiC

50mm (2″) – 150mm (6″) 4H SiC
Nitrogen doped, Vanadium doped, Undoped, and HPSI
On and Off Axis options
Single Side or Double Side Polished

6H SiC

50mm (2”) and 100mm (4”) 6H SiC
Type/Dopant options may vary with availability
Single Side or Double Side Polished

Anywhere in the Bay Area within 4 hours.

In the United States within 1 day.

Internationally within 3 days.