Properties of Silicon Carbide:
- Performs well at high temperatures.
- Low thermal expansion. SiC can handle temperatures up to 1600°C without losing strength.
- High resistance to corrosion, erosion and oxidation.
- Superior hardness properties; diamond is the only harder substance.
- Fast switching speeds, which improves miniaturization.
- Great thermal conductivity.
Silicon Carbide Deposition Process:
There are two primary ways to deposit silicon carbide: physical vapor deposition (PVD) and plasma enhanced chemical vapor deposition (PECVD).
Silicon carbide PVD is performed when powder silicon carbide is turned to vapor using one of two methods: either in a high temperature vacuum or with a gaseous plasma. After vaporizing all the material, it moves to a partial or full vacuum furnace containing the wafers. Once in the furnace, the vapor settles on the substrate surface, which results in a thin carborundum layer.
To deposit SiC through PECVD, a CVD furnace exposes the wafers to plasma in order to catalyze the chemical reaction on the substrate surface.