SVM Sputtered/Evaporated Metals:

  • Aluminum (Al)
  • Aluminum/Copper (AlCu) – .5%, 1%, 4%
  • Aluminum/Silicon (AlSi) – .1%, 1%, 2%
  • Aluminum Nitride (reactive)
  • Aluminum Oxide (Al2O3)
  • Carbon (C)
  • Chromium (Cr)
  • Chromium Oxide (Cr2O3) – Non-Reactive
  • Chromium Silicon (CrSi)
  • Cobalt (Co)
  • Copper (Cu)
  • Copper Nickel (CuNi) – 60/40
  • Germanium (Ge)
  • Gold (Au)
  • Halfnium (Hf)
  • Indium Tin Oxide (ITO)
  • Iron (Fe)
  • Molybdenum (Mo)
  • Nickel (Ni)
  • Niobium (Nb)
  • Palladium (Pd)
  • Platinum (Pt)
  • Ruthenium (Ru)
  • Silicon – doped & undoped
  • Silicon Carbide (SiC)
  • Silver (Ag)
  • Tantalum (Ta)
  • Tantalum Nitride (TaN)
  • Tin (Sn)
  • Titanium (Ti)
  • Titanium Oxide (TiO2)
  • Titanium Nitride (TiN)
  • Titanium Tungster (TiW)
  • Tungsten (W)
  • Tungsten Nitride (WN)
  • Tungsten Silicon (WSI)
  • Zirconium (Zr)
  • Zirconium Oxide (ZrO2)

SVM Chemical Vapor Deposition Films deposited with PECVD or LPCVD process:

CVD Metals:

  • Cobalt (Co)
  • Cobalt Nitride (CoN)
  • Titanium (Ti)
  • Titanium Nitride (TiN)
  • Tungsten (W)
  • Tungsten Nitride (WN)
  • Silicon Carbide (SiC)
  • Silicon Carbide Nitride (SiCN). SiCO)
  • Silicon Nitride (SiN)
  • Silicon Oxy-Nitride (SiON)

SVM Atomic Layer Deposition (ALD) Metals:

  • Aluminum Oxide (Al2O3)
  • Nickel Oxide (NiO)
  • Niobium Nitride (NbN)
  • Niobium Oxide (NiO2)
  • Niobium Oxygen (Nb2O5)
  • Silicon Carbide (SiC)
  • Silicon Carbide Nitride (SiCN)
  • Silicon Carbide-Oxygen (SICO)
  • Silicon Nitride (SiN)
  • Silicon Oxy-Nitride (SiON)
  • Tungsten (W)
  • Titanium Nitride (TiN)
  • Nickle Nitride (NiN)

Electroplated Metals:

  • Tin (Sn) or Tin alloys
  • Copper (Cu)
  • Nickel (Ni)
  • Silver (Ag)
  • Gold (Au)
  • Palladium (Pd)
  • Platinum (Pt)