SVM’S Wafer Laser Marking Capabilities:

  • Diameters: 50mm to 300mm
  • Character Height and Width: upon request
  • Font: 0.010 to 12
  • Depth: soft and hard laser marks available
  • Soft Mark: 1-5μm in depth
  • Hard Mark: 5μm to 100μm in depth
  • Mark Location: front or backside of wafer
  • Format: alphanumeric and barcode
  • Specialty Marks: company logo, etc.

Sacrificial protective layers such as oxidenitride, or photoresist are available to protect the wafer surface from debris generated during the laser marking process. SVM offers wafer cleaning options post marking.