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Laser marking allows a wafer fab to individually track wafers through their manufacturing process. Laser marking is done with no residual damage to the wafer. Laser marks are machine readable and do not limit any other processes that are performed on the substrate.

SVM’S Wafer Laser Marking Capabilities:

Diameters: 50mm to 300mm
Character Height and Width: upon request
Font: 0.010 to 12
Depth: soft and hard laser marks available
Soft Mark: 1-5μm in depth
Hard Mark: 5μm to 100μm in depth
Mark Location: front or backside of wafer
Format: alphanumeric and barcode
Specialty Marks: company logo, etc.

Sacrificial protective layers such as oxide, nitride, or photoresist are available to protect the wafer surface from debris generated during the laser marking process. SVM offers wafer cleaning options post marking.