Double Side Polished Wafers

Double Side Polished Wafers

Silicon Valley Microelectronics’ product line includes both single side polished (SSP) and double side polished (DSP) wafer substrates. Double side polished wafers are typically required in semiconductor, microelectromechanical systems (MEMS), and other applications where wafers with tightly controlled flatness characteristics are required. They are also needed for double side patterning and device manufacturing projects.

While semiconductor devices continue to shrink, it is becoming increasingly important for wafers to have high surface quality on both their front and back side. Currently these wafers are most common in MEMS, wafer bonding, silicon on insulator (SOI) fabrication, and applications with tight flatness requirements. Silicon Valley Microelectronics acknowledges the evolution of the semiconductor industry and is committed to finding long term solutions for all customer requirements.

SVM carries a large inventory of double side polished wafers in all wafer diameters ranging from 50mm to 300mm. If your specification is not available in our inventory, we have established long term relationships with numerous manufacturing partners that are capable of custom manufacturing wafers to fit any unique specifications. Double side polished wafers are available in silicon, glass and other materials commonly used in the semiconductor industry.

All factory sealed 300mm silicon wafers are double side polished. SVM offers site flatness measurements down to <0.05 μm or greater, site size 26mm x 8mm, 100% PUA.