Lithography

Standard test patterns are available for use in CMP, Etch, Clean, Packaging, and Biotech applications. In addition to our standard test patterns, SVM accepts custom patterning projects based on end-user design. 

• Materials: silicon, glass
• Diameters: 50mm to 300mm
• Lithography Tools: immersion, scanner, stepper, proximity/contact aligner, e-beam
• Technology Nodes: 65nm, 90nm, 130nm, 180nm, 250nm and larger
• Photoresist: 193nm, 248nm(DUV), I-Line
• Etch: Wet, RIE, DRIE, Lift off
• CMP: W, Cu, Al, oxide, TEOS, SiN, etc.
• Metrology: mask/reticle manufacture, SEM, cross section, e-test etc.

Test Reticles:

• CMP dishing and erosion
• Surface trench isolation (STI)
• Damascene and dual damascene
• Line/Space arrays
• Redistribution later (RDL)
• Via arrays
• Bond Pads
• Daisy chain
• Memory patterns
• E-testable structures
• Wafer level packaging (WLP)
• TSV – Through Silicon Via
• Cu Pillars

Specialty Products:

• Precious metals: Au, Pd, Ag, Pt
• Thick photoresist
• Polymides

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