Standard test patterns are available for use in CMP, Etch, Clean, Packaging, and Biotech applications. In addition to our standard test patterns, SVM accepts custom patterning projects based on end-user design.
- Materials: Silicon, glass
- Diameters: 50mm to 300mm
- Lithography Tools: Immersion, scanner, stepper, proximity/contact aligner, e-beam
- Technology Nodes: 65nm, 90nm, 130nm, 180nm, 250nm and larger
- Photoresist: 193nm, 248nm(DUV), I-Line
- Etch: Wet, RIE, DRIE, Lift off
- CMP: W, Cu, Al, oxide, TEOS, SiN, etc.
- Metrology: Mask/reticle manufacture, SEM, cross section, e-test etc.
- CMP dishing and erosion
- Surface trench isolation (STI)
- Damascene and dual damascene
- Line/Space arrays
- Redistribution Later (RDL)
- Via arrays
- Bond Pads
- Daisy chain
- Memory patterns
- E-testable structures
- Wafer Level Packaging (WLP)
- TSV – Through Silicon Via
- Cu Pillars
- Precious metals: Au, Pd, Ag, Pt
- Thick photoresist
Anywhere in the Bay Area within 4 hours.
In the United States within 1 day.
Internationally within 3 days.