Wafer Films & Processing - SVMI

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Silicon Nitride Films

Deposited Metals

Low Particle Wafer TEOS

Silicon Carbide Films

Chemical Vapor Deposition

AnnealingWe are pleased to supply nitrogen and forming gas annealing services that can achieve temperatures up to 1,100C°.

ImplantWe offer wafer implant services for silicon, SOI, and other types of specialty substrates such as GaAs, GaN, InP, SiGe, SiC, and more.

Wafer Reclaim & PolishingUtilizing a CMP process that features targeted slurries, we can supply high quality polishing results across different materials.

DicingCombining a multitude of techniques, we can successfully assist our customers in reclaiming their 200mm and 300mm wafers for further use.

Wafer Downsizing/Laser CutdownTo ensure we supply you with a high-quality finished product, a low stress coring method is used to carefully resize wafers.

Epitaxial Wafer ServiceWe can provide single, dual, and triple layer epitaxial solutions that can be done on silicon, SOI and SOS wafers.

Laser MarkingPerfect for those looking for a quick-turn service for marking pre-existing wafers or die, SVM is ready to help on all your marking projects.

LithographyLearn more about the types of blanket photoresists we supply, as well as our contact, e-beam and stepper lithography capabilities.

Wafer ThinningSilicon Valley Microelectronics offers quick and reliable service for backside or frontside thinning of various types of substrates and materials.

Processing

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In the United States within 1 day.

Internationally within 3 days.